Manufacturing apparatus for semiconductor devices

Details Manufacturing apparatus for semiconductor devices Manufacturing apparatus for semiconductor devices

1985-11-14

1987-09-15

Kellogg, Arthur

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

156345, 156643, 156646, 156666, C23F 102

Patent

active

046937790

ABSTRACT:
A semiconductor device manufacturing apparatus is disclosed which comprises a reaction chamber; at least one light source for radiating light to a wafer disposed in the reaction chamber and performing plural processes by the photo-assisted reactions; a gas introducing means for introducing gaseous reactants into the reaction chamber; a gas exhausting means for exhausting the interior of the reaction chamber; and a light source for removing by light irradiation undesirable gaseous constituents which adhered to the wafer and the chamber inner wall in the preceding step. Since undesirable gaseous constituents adhered to the wafer and thereabouts can be removed, it is possible to effect plural processes for the wafer in the same chamber.

REFERENCES:
patent: 4427723 (1984-01-01), Swain
patent: 4490210 (1984-12-01), Chen et al.

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