Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate
2011-04-26
2011-04-26
Booth, Richard A. (Department: 2812)
Semiconductor device manufacturing: process
Coating with electrically or thermally conductive material
To form ohmic contact to semiconductive material
Reexamination Certificate
active
07932180
ABSTRACT:
A method of manufacturing a semiconductor device. The method includes providing a semiconductor chip including contact elements on a first face and a first layer between the first face and a second face opposite the first face. Placing the semiconductor chip on a carrier with the contact elements facing the carrier and etching the semiconductor chip until the first layer is reached.
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Fuergut Edward
Mahler Joachim
Booth Richard A.
Dicke, Billig & Czaja P.L.L.C.
Infineon - Technologies AG
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