Manufacture of wafer-scale integrated circuits

Details Manufacture of wafer-scale integrated circuits Manufacture of wafer-scale integrated circuits

1981-12-07

1984-03-06

Louie, Jr., Won H.

Radiation imagery chemistry: process, composition, or product th

Imaging affecting physical property of radiation sensitive...

Making electrical device

1566591, G03C 500

Patent

active

044354983

ABSTRACT:
In the course of manufacturing a wafer-scale integrated circuit, the metalization for interconnection both within each cell and between cells is achieved by the etching of a single metal layer, photoresist being deposited on the layer and exposed using a step-and-repeat mask for those areas within each cell and using a whole-wafer reticle mask for the areas of interconnection between the cells.

REFERENCES:
patent: 3385702 (1968-05-01), Koehler
patent: 3649392 (1972-03-01), Schneck

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