Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Patent
1996-08-29
1998-11-10
Chaudhuri, Olik
Semiconductor device manufacturing: process
Coating with electrically or thermally conductive material
To form ohmic contact to semiconductive material
438632, 438648, H01L 2144
Patent
active
058343709
ABSTRACT:
An element including a polycide electrode is formed on a silicon substrate, and after a BPSG film is deposited as an interlevel insulating film and a contact hole is formed therein, the substrate is lamp annealed in an atmosphere containing oxygen to reflow the BPSG film. After an HF process, an Al wiring is formed on the BPSG film, contacting the polycide electrode via the contact hole. It is possible to prevent an increase in the contact resistance of the polycide electrode.
REFERENCES:
patent: 4535528 (1985-08-01), Chen et al.
patent: 4585515 (1986-04-01), Maa
patent: 5322812 (1994-06-01), Dixit et al.
patent: 5364817 (1994-11-01), Lur et al.
patent: 5449640 (1995-09-01), Hunt et al.
patent: 5506177 (1996-04-01), Kishimoto et al.
patent: 5578522 (1996-11-01), Nakamura et al.
Chaudhuri Olik
Turner Kevin F.
Yamaha Corporation
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