Manufacture of printed circuit conductors by a partially additiv

Details Manufacture of printed circuit conductors by a partially additiv Manufacture of printed circuit conductors by a partially additiv

1993-03-24

1994-10-25

McCamish, Marion E.

Radiation imagery chemistry: process, composition, or product th

Imaging affecting physical property of radiation sensitive...

Radiation sensitive composition or product or process of making

430311, 430313, 430327, 427 98, G03C 500, H05K 300

Patent

active

053588258

ABSTRACT:
The adhesion of epoxy-resin containing resist compositions to a copper surface, which resist compositions are exposed to actinic radiation, developed and hardened, is enhanced by contacting the copper surface with an N-heterocyclic compound comprising --NH.sub.2 groups and drying the copper surface comprising the N-heterocyclic compound prior to application of the resist. Printed wiring boards produced by a partially additive process can be produced using this adhesion enhancement technique.

REFERENCES:
patent: 4643793 (1987-02-01), Nakaso et al.
patent: 4693959 (1987-09-01), Ashcraft
patent: 4837086 (1989-06-01), Takahashi
patent: 5028513 (1991-07-01), Murakami et al.
patent: 5091283 (1992-02-01), Tanaka et al.
patent: 5100767 (1992-03-01), Yanagawa et al.
patent: 5153987 (1992-10-01), Takahashi
patent: 5268255 (1993-12-01), Kikuchi

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