Manufacture of printed circuit boards

Details Manufacture of printed circuit boards Manufacture of printed circuit boards

1984-05-30

1986-09-09

Kimlin, Edward

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

156902, 427 97, 29852, 428901, 174 685, B05D 512, C23F 102

Patent

active

046107584

ABSTRACT:
A method of manufacture of a printed circuit board having plated-through holes interconnecting printed conductors formed on each of two external surfaces, includes the step of masking those areas of the external surfaces where solder will subsequently be required to adhere. The unmasked conductive areas are then coated with a material which prevents wetting by normal soldering techniques. The masking material is subsequently removed. The coating material may be electroless nickel, or electroplated nickel or suitable nickel alloys.

REFERENCES:
patent: 3236708 (1966-02-01), Tillis
patent: 3462832 (1969-08-01), Kubik
patent: 3702284 (1972-11-01), Merkenschlager
patent: 4024631 (1977-05-01), Castillero
patent: 4104111 (1978-08-01), Mack
patent: 4285991 (1981-08-01), Gedrat et al.
patent: 4512829 (1985-04-01), Ohta et al.

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