Manufacture of flip-chip device

Details Manufacture of flip-chip device Manufacture of flip-chip device

1998-02-27

2000-01-18

Baxter, Janet

Radiation imagery chemistry: process, composition, or product th

Imaging affecting physical property of radiation sensitive...

Making electrical device

430313, 430328, 430394, G03C 500

Patent

active

06015652&

ABSTRACT:
The specification describes a process for applying under bump metallization (UBM) for solder bump interconnections on interconnection substrates. The process uses a lift-off technique for defining the UBM and the lift-off technique has improved edge definition as the result of radiation hardening of the photoresist after lithographic patterning.

REFERENCES:
patent: 4224361 (1980-09-01), Romankiw
patent: 4273859 (1981-06-01), Mones et al.
patent: 4982267 (1991-01-01), Mones et al.
patent: 5158860 (1992-10-01), Gulla et al.
Klose, Helmut; Sigush, Reiner; and Arden, Wolfgang. "Imaging Reversal of Positive Photoresist: Characterization and Modeling". IEEE Transactions on Electron Devices, 32, 9, 1654-1661, Sep. 1985.

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