Manufacture of fine structures for semiconductor contacting

Details Manufacture of fine structures for semiconductor contacting Manufacture of fine structures for semiconductor contacting

1987-05-21

1989-01-03

McCamish, Marion C.

Radiation imagery chemistry: process, composition, or product th

Imaging affecting physical property of radiation sensitive...

Making electrical device

430316, 430318, 430329, 430394, 1566591, 1566611, 156664, 204 15, G03L 500

Patent

active

047956941

ABSTRACT:
A method for the manufacture of fine structures for semiconductors were in a photographic structuring is carried out on both sides of a smooth, non-stressed metal tape. The tape is etched from both sides. A single sided metal deposition than takes place by means of a float type electroplating. Stabilization of the fine structure is achieved by depositing a lacquer or resin by an electrophoretic deposition or by electro-immersion lacquering. The insulator carrier is applied as one of the final steps of the process.

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patent: 4701363 (1987-10-01), Barber
patent: 4707418 (1987-11-01), Takias et al.

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