Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step
Patent
1978-07-26
1980-06-24
Powell, William A.
Adhesive bonding and miscellaneous chemical manufacture
Delaminating processes adapted for specified product
Delaminating in preparation for post processing recycling step
29576S, 29589, 156252, 156634, 156645, 156656, 156661, 357 70, C23F 102
Patent
active
042093554
ABSTRACT:
A composite tape product, employed in the gang bonding of semiconductor devices, is manufactured on an insulating strip that has a series of apertures therein. A plurality of metal fingers are bonded to the strip so that groups of fingers extend over the apertures. The finger ends terminate in a configuration where each finger mates with an integrated circuit bonding pad. A thermocompression bonding tool can then gang bond the fingers to the bonding pads. The tape mounted fingers then include the bonded chip and the tape can then carry the chip to the chip mounting and finger bonding operation. The composite tape is manufactured using mating prepunched or pre-etched insulating and metal strips. The metal strip is first partly etched to define the finger pattern. Then the metal and insulating strips are bonded together so that the partly defined finger patterns register with the prepunched insulating tap apertures. Then the finger etching is completed to form the composite tape that can be used in automatic assembly machines.
REFERENCES:
patent: 3480836 (1969-11-01), Aronstein
patent: 3689991 (1972-09-01), Aird
patent: 3763404 (1973-10-01), Aird
patent: 3781596 (1973-12-01), Galli et al.
patent: 3795043 (1974-03-01), Forlani
patent: 3962002 (1976-06-01), Finkbeiner et al.
patent: 3968563 (1976-07-01), Hamlin
patent: 4063993 (1977-12-01), Burns
National Semiconductor Corporation
Powell William A.
Sheridan James A.
Woodward Gail W.
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