Manifold systems and methods for delivering samples of microelec

Measuring and testing – Specimen stress or strain – or testing by stress or strain... – Specified electrical sensor or system

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73 2341, 73 2342, 7386303, G01N 100, G01N 3004

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active

059964200

ABSTRACT:
Manifold systems and methods for delivering samples of microelectronic device processing gases to gas analyzers include a first passage that receives microelectronic device processing gas from a gas source and discharges the gas at a set pressure through a second passage to a selected gas analyzer. A third passage supplies low-pressure cleaning gas to clean the first and second passages. Multiple gas sources can be connected to multiple gas analyzers via a single manifold system. Steps for distributing semiconductor device processing gas from a gas source to a gas analyzer include purging the first and second passages with low-pressure cleaning gas to remove contaminants. After removing the low-pressure gas from the first and second passages, the first and second passages are isolated from each other and a semiconductor processing gas is discharged from a gas source into the isolated first passage. The semiconductor processing gas is discharged from the first passage to the gas analyzer at a predetermined flow rate and pressure via the second passage. After the semiconductor processing gas has been discharged from the first passage to the gas analyzer, the second passage is isolated from the gas analyzer. Semiconductor processing gas remaining within the first and second passages is then removed. The first and second passages are then purged with high-pressure cleaning gas to remove contaminants.

REFERENCES:
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patent: 5665902 (1997-09-01), Wang et al.
patent: 5822951 (1998-10-01), Rosik
patent: 5827945 (1998-10-01), Arnold
patent: 5872306 (1999-02-01), Arnold

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