Mandrel with controlled release layer for multi-layer...

Details Mandrel with controlled release layer for multi-layer... Mandrel with controlled release layer for multi-layer...

2006-01-31

2008-03-11

Chea, Thorl (Department: 1752)

Radiation imagery chemistry: process, composition, or product th

Imaging affecting physical property of radiation sensitive...

Making electrical device

C430S320000, C428S041800

Reexamination Certificate

active

07341824

ABSTRACT:
A system and method are provided for fabricating an orifice plate for use in an ink jet printing system. Initially, a substrate base is provided, and a controlled-release layer is applied to a surface of the substrate base. A conductive metal layer is adherently coated on the controlled-release layer. At least one dielectric peg is created on a portion of the conductive metal layer, and a nozzle layer is applied on the conductive metal layer to partially cover the dielectric peg. A trench is formed that covers a nozzles prior to formation of a reinforcing layer. The controlled-release layer is removed to separate the orifice plate from the substrate base. The conductive metal layer is selectively etched from the nozzle layer to complete fabricating the orifice plate.

REFERENCES:
patent: 4268610 (1981-05-01), Roos
patent: 4773971 (1988-09-01), Lam et al.
patent: 4972204 (1990-11-01), Sexton
patent: 5277783 (1994-01-01), Ohashi et al.
patent: 5462648 (1995-10-01), Nebashi et al.
patent: 5545511 (1996-08-01), Hulderman et al.
patent: 6303042 (2001-10-01), Hawkins et al.
patent: 0 489 246 (1992-06-01), None
patent: 0 713 929 (1996-05-01), None

Affiliated with

Also associated with

Rating

Mandrel with controlled release layer for multi-layer... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Mandrel with controlled release layer for multi-layer..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Mandrel with controlled release layer for multi-layer... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3963048