Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Patent
1996-03-07
1997-09-09
Niebling, John
Semiconductor device manufacturing: process
Coating with electrically or thermally conductive material
To form ohmic contact to semiconductive material
438655, 438682, H01L 2128
Patent
active
056656475
ABSTRACT:
A method of manufacturing a semiconductor device includes the steps of forming a silicon oxide film having a thickness of 5 nm or less on a silicon substrate or polysilicon film with a solution exhibiting an oxidation effect, forming a metal film on the silicon oxide film, and forming a silicide layer on the upper surface of the silicon substrate or polysilicon film by performing predetermined heat treatment.
REFERENCES:
patent: 4784973 (1988-11-01), Stevens et al.
patent: 5194405 (1993-03-01), Sumi et al.
Bilodeau Thomas G.
NEC Corporation
Niebling John
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