Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Making electrical device
Patent
1993-04-30
1995-09-19
Duda, Kathleen
Radiation imagery chemistry: process, composition, or product th
Imaging affecting physical property of radiation sensitive...
Making electrical device
430318, 430394, 430396, 430 30, G03F 720
Patent
active
054514894
ABSTRACT:
Each transistor or logic unit on an integrated circuit wafer is tested prior to interconnect metallization. By means of CAD software, the transistor or logic units placement net list is revised to substitute redundant defect-free logic units for defective ones. Then the interconnect metallization is laid down and patterned under control of a CAD computer system. Each die in the wafer thus has its own interconnect scheme, although each die is functionally equivalent, and yields are much higher than with conventional testing at the completed circuit level.
The individual transistor or logic unit testing is accomplished by a specially fabricated flexible tester surface made in one embodiment of several layers of flexible silicon dioxide, each layer containing vias and conductive traces leading to thousands of microscopic metal probe points on one side of the test surface. The probe points electrically contact the contacts on the wafer under test by fluid pressure.
REFERENCES:
patent: Re33836 (1992-03-01), Resor
patent: 3618201 (1971-11-01), Makimoto et al.
patent: 3702025 (1972-11-01), Archer
patent: 3835530 (1974-09-01), Kilby
patent: 4038599 (1977-07-01), Bove et al.
patent: 4065717 (1977-12-01), Kattner et al.
patent: 4566184 (1986-01-01), Higgins et al.
patent: 4573008 (1986-02-01), Lischke
patent: 4574235 (1986-03-01), Kelly et al.
patent: 4585727 (1986-04-01), Reams
patent: 4590422 (1986-05-01), Milligan
patent: 4617730 (1986-10-01), Geldermans et al.
patent: 4636722 (1987-01-01), Andezzone
patent: 4644264 (1987-02-01), Beha et al.
patent: 4647851 (1987-03-01), Dugan
patent: 4649338 (1987-03-01), Dugan
patent: 4649339 (1987-03-01), Grangroth et al.
patent: 4686112 (1987-08-01), Hoffman
patent: 4697143 (1987-09-01), Lockwood et al.
patent: 4715928 (1987-12-01), Hamby
patent: 4755747 (1988-07-01), Sato
patent: 4799009 (1989-01-01), Tada et al.
patent: 4814283 (1989-03-01), Temple et al.
patent: 4820976 (1989-04-01), Brown
patent: 4853627 (1989-08-01), Gleason et al.
patent: 4891585 (1990-01-01), Janko et al.
Wafer Scale Integration-Historical Perspective, N. R. Strader et al., (date unknown).
"Plastics That Conduct Electricity", R. B. Kaner and A. G. MacDiarmid, Scientific American, pp. 106-111, Feb. 1988.
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