Magnetron sputtering source

Details Magnetron sputtering source Magnetron sputtering source

1993-01-15

1994-08-02

Weisstuch, Aaron

Chemistry: electrical and wave energy

Apparatus

Coating, forming or etching by sputtering

20429811, 20429812, 20429819, C23C 1435

Patent

active

053337263

ABSTRACT:
A magnetron sputtering source for sputtering coating substrates includes a high thermal conductivity electrically insulating ceramic and magnetically attached sputter target which can eliminate vacuum sealing and direct fluid cooling of the cathode assembly. The magnetron sputtering source design results in greater compactness, improved operating characteristics, greater versatility, and low fabrication cost. The design easily retrofits most sputtering apparatuses and provides for safe, easy, and cost effective target replacement, installation, and removal.

REFERENCES:
patent: 4515675 (1985-05-01), Kieser et al.
patent: 4569745 (1986-02-01), Nagashima

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