Chemistry: electrical and wave energy – Processes and products – Coating – forming or etching by sputtering
Patent
1997-12-12
2000-05-16
Nguyen, Nam
Chemistry: electrical and wave energy
Processes and products
Coating, forming or etching by sputtering
20419213, 20419216, 20429808, 20429803, 20429816, C23C 1434
Patent
active
060632453
ABSTRACT:
A procedure and apparatus for the application of carbon layers using reactive magnetron sputtering is described. The process includes sputtering of at least two targets made of carbon in a reactive atmosphere with a pulsed energy feed. During a pattern period of the pulses all targets (magnetrons) are once switched on as an anode and at least one target is switched as an anode at all times Various embodiments include detection and limitation of the "microarcs"; executing of regeneration processes according to fixed predetermined time intervals for at least 5 seconds. In one embodiment a microarc is detected on a magnetron and if a next pulse-off time is more than a selected time period away, then the magnetron is connected to a positive pole of the power supply. In another embodiment of the invention a pulsed negative voltage is applied to a substrate being sputtered by connecting the substrate to a negative pole of a pulsed power supply having a positive pole connected to a positive pole of a power supply for a magnetron. In another embodiment of the invention there is an electrode insulated from an installation mass which is connected to at least one positive pole of a power supply during the periodic pausing sputtering of substrates for regeneration.
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Frach Peter
Goedicke Klaus
Haese Friedel
Junghahnel Michael
Meyer Dieter W.
Cantelmo Gregg
International Business Machines - Corporation
Knight G. Marlin
Nguyen Nam
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