Chemistry: electrical and wave energy – Processes and products – Coating – forming or etching by sputtering
Patent
1988-02-08
1989-07-25
Weisstuch, Aaron
Chemistry: electrical and wave energy
Processes and products
Coating, forming or etching by sputtering
20419215, 20419226, 20419227, 204298, C23C 1434
Patent
active
048510955
ABSTRACT:
A rotary cylindrical sputtering system incorporates separate, separately-controlled linear magnetron sputter cathode and reaction zones for sputter depositing materials such as refractory metals and forming oxides and other compounds and alloys of such materials. The associated process involves rotating or translating workpieces past the differentially pumped, atmospherically separated, sequentially or simultaneously operated cathode and reaction zones and is characterized by the ability to form a wide range of materials, by high throughput, and by controlled coating thickness, including both constant and selectively varied thickness profiles.
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Austin R. Russel
Lefebvre Paul M.
Manley Barry W.
Scobey Michael A.
Seddon Richard I.
Optical Coating Laboratory, Inc.
Weisstuch Aaron
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