Magnetron sputtering apparatus and method

Details Magnetron sputtering apparatus and method Magnetron sputtering apparatus and method

1995-07-07

1996-09-24

Nguyen, Nam

Chemistry: electrical and wave energy

Processes and products

Coating, forming or etching by sputtering

20429809, 20429811, 20429819, 2042982, C23C 1434

Patent

active

055587496

ABSTRACT:
A magnetron sputtering apparatus has a ring-shaped flat target and includes magnets of the same polarity respectively arranged at a front side and a rear side of the target extending along an inner peripheral edge of the target, and magnets of the same polarity respectively arranged at the front side and the rear side of the target extending along an outer peripheral edge of the target. The magnets extending along the inner peripheral edge of the target are inverted in polarity relative to the other magnets extending along the outer peripheral edge of the target.

REFERENCES:
patent: 4370217 (1983-01-01), Funaki
patent: 4385979 (1983-05-01), Pierce et al.
patent: 5069772 (1991-12-01), Fritsche et al.
patent: 5133850 (1992-07-01), Kukla et al.
patent: 5266178 (1993-11-01), Sichmann

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