Chemistry: electrical and wave energy – Processes and products – Coating – forming or etching by sputtering
Patent
1994-03-17
1996-09-17
Breneman, R. Bruce
Chemistry: electrical and wave energy
Processes and products
Coating, forming or etching by sputtering
20429819, 20429818, 20429805, 20429806, 20429826, 427523, 427524, 427528, C23C 1435
Patent
active
055565190
ABSTRACT:
A magnetron sputter ion plating system has two or more magnetron assemblies spaced around a substrate centrally located relative to the magnetrons. The magnetrons are arranged so that adjacent magnetrons have outer magnetic assemblies of opposite polarity, so that magnetic field lines link adjacent magnetrons, so as to produce a substantially closed ring of magnetic flux. This substantially traps all electrons generated in the system, and increase the level of ionization surrounding the substrates increasing the ion bombardment of the substrates. Several embodiments are disclosed.
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