Magnetron sputter gun target assembly with distributed magnetic

Details Magnetron sputter gun target assembly with distributed magnetic Magnetron sputter gun target assembly with distributed magnetic

1991-08-05

1992-12-29

Nguyen, Nam X.

Chemistry: electrical and wave energy

Apparatus

Coating, forming or etching by sputtering

20429819, 20429821, 20419212, C23C 1434

Patent

active

051748800

ABSTRACT:
A target assembly is provided having a circular flat target with an inner ring and an outer ring extending from the sputtering surface. A ferromagnetic outer pole member surrounds the target and the outer ring. A ferromagnetic inner pole member is surrounded by the target and the inner ring. A ferromagnetic backing member is positioned against the base surface of the target and has an outer portion positioned against the outer pole member, and an inner portion positioned against the inner pole member. These are positioned relative to the source of the magnetic field for conducting flux in a first path through the outer portion and the outer pole member, across the sputtering surface between the outer and inner rings, and through the inner pole member and inner portion. The backing member further includes a shunt portion intermediate between and magnetically spaced from the inner and outer portions. This shunt portion extends away from the target toward the source of the magnetic field associated with the inner portion for conducting magnetic flux in a second path through a portion of the target intermediate the inner and outer surfaces, and across the sputtering surface toward the outer ring.

REFERENCES:
patent: 4401539 (1983-08-01), Abe et al.
patent: 4486287 (1984-12-01), Fournier
patent: 4515675 (1985-05-01), Kieser et al.
patent: 4572776 (1986-02-01), Aichert et al.
patent: 4604180 (1986-08-01), Hirukawa et al.
patent: 4933064 (1990-06-01), Geisler et al.
patent: 5069772 (1991-12-01), Fritsche et al.

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