Magnetron atomization source and method of use thereof

Chemistry: electrical and wave energy – Processes and products – Coating – forming or etching by sputtering

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20429811, 20429818, C23C 1434

Patent

active

056883811

ABSTRACT:
For optimizing the yield of atomized-off material on a magnetron atomization source, a process space, on the source side, is predominantly walled by the atomization surface of the target body. The magnetron atomization source has a target body with a mirror-symmetrical, concavely constructed atomization surface with respect to at least one plane and a magnetic circuit arrangement operable to generate a magnetic field over the atomization surface. The magnetic circuit arrangement includes an anode arrangement, a receiving frame which extends around an edge of the target body and is electrically insulated with respect thereto. The receiving frame has a receiving opening for at least one workpiece to be coated. The magnetron source can be used to provide storage disks, such as CDs, with an atomization coating.

REFERENCES:
patent: 5080772 (1992-01-01), Hurwitt et al.
patent: 5112467 (1992-05-01), Zejda
patent: 5164063 (1992-11-01), Braeuer et al.
patent: 5174875 (1992-12-01), Hurwitt et al.
patent: 5330632 (1994-07-01), Sichmann
patent: 5334302 (1994-08-01), Kubo et al.

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