Magnetically enhanced radio frequency reactive ion etching metho

Details Magnetically enhanced radio frequency reactive ion etching metho Magnetically enhanced radio frequency reactive ion etching metho

1995-05-26

1998-03-17

Breneman, R. Bruce

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

1566431, 1566461, H01L 21302, H01L 2130

Patent

active

057282617

ABSTRACT:
An RF diode reactive ion etching (RIE) method and apparatus (20) include an evacuable reaction chamber (22) in which an anode electrode (76) and cathode electrode (30)are spaced-apart facing each other and defining a gap (78) between the electrodes. A substrate (40) to be etched is placed in thermal contact with the cathode. A magnet (70) behind the anode provides a magnetic field which is characterized by lines-of-force (80) extending continuously through the gap from one of the electrodes to the other. To etch the substrate the reaction chamber is evacuated, an etchant-gas is admitted into the gap at a predetermined low pressure, a plasma (79) including ions of the etchant gas is generated by applying RF power to the electrodes. The substrate is etched by etchant gas ions attracted from the plasma toward the substrate by a negative self-bias potential established on the cathode.

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