Material or article handling – Apparatus for moving material between zones having different... – For carrying standarized mechanical interface type
Patent
1996-12-11
1998-11-10
Bucci, David A.
Material or article handling
Apparatus for moving material between zones having different...
For carrying standarized mechanical interface type
414331, 414416, 414786, 414937, 414939, 414940, B65G 6502
Patent
active
058334262
ABSTRACT:
A wafer extraction platform that is compatible with a high vacuum transfer system includes magnetically coupled upper and lower assemblies. A vacuum to atmosphere seal on the platform is maintained with two O-rings. Two opposing arrays of spaced, parallel blades in the upper assembly define slots for receiving wafers from a cassette. The upper assembly moves in response to a magnetically coupled linear slide mounted on the lower assembly. The upper assembly moves outside the load lock, and the blades pick up and simultaneously extract the wafers from the cassette. The upper assembly retracts into the load lock, and the wafers are transferred to the process chamber. A linear motor mounted at atmospheric pressure inside the lower assembly permits the horizontal movement of the upper assembly while holding the blades parallel to the wafers. Level adjustment screws and a bellows are used to level the platform.
REFERENCES:
patent: 4427332 (1984-01-01), Manriquez
patent: 4550242 (1985-10-01), Uehara et al.
patent: 4619573 (1986-10-01), Rathmann et al.
patent: 4768911 (1988-09-01), Balter
patent: 4851018 (1989-07-01), Lazzari et al.
patent: 4968206 (1990-11-01), Trillwood
patent: 5007784 (1991-04-01), Genov et al.
patent: 5234303 (1993-08-01), Koyano
patent: 5409348 (1995-04-01), Suzuki
patent: 5435682 (1995-07-01), Crabb et al.
patent: 5507614 (1996-04-01), Leonov et al.
patent: 5540821 (1996-07-01), Tepman
patent: 5562387 (1996-10-01), Ishii et al.
patent: 5604443 (1997-02-01), Kitamura et al.
patent: 5613821 (1997-03-01), Muka et al.
patent: 5626456 (1997-05-01), Nishi
patent: 5647718 (1997-07-01), Wiesler et al.
Applied Materials Inc.
Bucci David A.
Glenn Michael A.
LandOfFree
Magnetically coupled wafer extraction platform does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Magnetically coupled wafer extraction platform, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Magnetically coupled wafer extraction platform will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1510613