Magnetic tunnel junctions for MRAM devices

Static information storage and retrieval – Systems using particular element – Magnetoresistive

Reexamination Certificate

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C257S295000

Reexamination Certificate

active

07149105

ABSTRACT:
Methods of manufacturing MTJ memory cells and structures thereof. A diffusion barrier is disposed between an anti-ferromagnetic layer and a pinned layer of an MTJ memory cell to improve thermal stability of the MTJ memory cell. The diffusion barrier may comprise an amorphous material or a NiFe alloy. An amorphous material may be disposed adjacent a bottom surface of a tunnel junction, within a free layer, or both. An MTJ memory cell with improved thermal stability and decreased Neel coupling is achieved.

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Worledge, D.C., et al., “Magnetoresistance Measurement of Unpatterned Magnetic Tunnel Junction Wafers by Current-in-Plane Tunneling,” Applied Physics Letters, Jul. 7, 2003, pp. 84-86, vol. 83, No. 1, MRAM Development Alliance, IBM/Infineon Technologies, Yorktown Heights, NY.

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