Magnetic self-assembly for integrated circuit packages

Details Magnetic self-assembly for integrated circuit packages Magnetic self-assembly for integrated circuit packages

2005-03-07

2009-11-10

Estrada, Michelle (Department: 2823)

Active solid-state devices (e.g., transistors, solid-state diode

Responsive to non-electrical signal

Magnetic field

C257S108000, C257S659000, C257SE21665, C438S003000

Reexamination Certificate

active

07615836

ABSTRACT:
An integrated circuit package may include a substrate and an integrated circuit. The substrate may include at least one region, and a first magnetic material associated with the at least one region. The integrated circuit may have a second magnetic material associated therewith. The second magnetic material may be attracted to the first magnetic material to coupled the integrated circuit to the at least one region of the substrate. The IC package may be utilized in an RFID tag of an RFID system. An associated method for assembling an integrated circuit to a substrate is also provided.

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