Magnetic alignment apparatus and method for self-alignment betwe

Metal working – Method of mechanical manufacture – Electrical device making

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29833, 414783, 414816, H05K 330

Patent

active

060499745

ABSTRACT:
A magnetic alignment apparatus (20) is provided for aligning a semiconductor die (11) and a packaging substrate (12) to enable aligned mounting therebetween. The alignment apparatus (20) includes a first magnetic device (23) coupled to the die (11) and adapted to generate a first magnetic field (25) oriented relative to a first reference point (26) of the die (11). A second magnetic device (27) is coupled to the substrate (12) and adapted to generate a second magnetic field (28) oriented relative to a second reference point (30) of the substrate (12). The first magnetic field (25) and the second magnetic field (28) cooperate to directionally align the first reference point (26) of the die substantially with the second reference point (30) of the substrate (12).

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patent: 3612955 (1971-10-01), Butherus
patent: 3700155 (1972-10-01), Hermanns
patent: 3776394 (1973-12-01), Miller
patent: 3868759 (1975-03-01), Hartleroad
patent: 3887997 (1975-06-01), Hartleroad et al.
patent: 3911568 (1975-10-01), Hartleroad et al.
patent: 3911569 (1975-10-01), Hartleroad et al.
patent: 3960279 (1976-06-01), Hartleroad et al.

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