Luminate for the formation of beam leads for IC chip bonding

Details Luminate for the formation of beam leads for IC chip bonding Luminate for the formation of beam leads for IC chip bonding

1987-07-24

1988-12-20

Michl, Paul R.

Radiation imagery chemistry: process, composition, or product th

Imaging affecting physical property of radiation sensitive...

Radiation sensitive composition or product or process of making

430288, 430281, 430285, 430277, 430278, 430276, 522142, G03C 194, G03C 168

Patent

active

047925175

ABSTRACT:
A laminate, adapted for manufacturing frames of metal beam leads that are bonded to integrated circuit chips, comprises

REFERENCES:
patent: 4247623 (1981-01-01), Guild
patent: 4322490 (1982-03-01), Molaire
patent: 4533445 (1985-08-01), Orio
patent: 4619890 (1986-10-01), Molaire et al.

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