LSI package board

Details LSI package board LSI package board

1995-03-20

1996-10-15

Crane, Sara W.

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

For plural devices

257700, 257691, H01L 2348, H01L 2352, H01L 2940

Patent

active

055657060

ABSTRACT:
A thin and high-density package board used with general-purpose mainframe computers and high-speed processors is provided. On a ceramic substrate on which memory LSIs and a logic LSI with only elements formed without multilayer wiring are mounted, a multilayer wiring layer insuring signal transfer of the LSIs is formed, providing a thin package board.

REFERENCES:
patent: 4322778 (1982-03-01), Barbour et al.
patent: 4672421 (1987-06-01), Lin
patent: 5049978 (1991-09-01), Bates et al.
patent: 5280192 (1994-01-01), Kryzaniwasky
patent: 5315486 (1994-05-01), Fillion et al.
patent: 5331203 (1994-07-01), Wojnarowski et al.
patent: 5391917 (1995-02-01), Gilmour et al.
M. Gdula et al, "An Overlay Interconnect Technology for 1GHz and Above MCMs", IEEE, Mar. 18-20, 1992, Santa Cruz, CA, pp. 171-174.
M. Gdula et al., "High Density Overlay Interconnect (HDI) Delivers High Frequency Performance for GaAs Systems", IEEE, Mar. 15-18, 1993, pp. 33-38.
M. Gdula et al., "A High-Speed, High Density Multiprocessing Module Made with the General Electric High-Density Interconnect Technology", Digital Signal Processing, vol. 2, No. 4, Oct. 1992, pp. 247-251.
IBM J. Res. Develop., vol. 26, No. 1, Jan. 1982, Donald J. Seraphim, "A New Set of Printed-Circuit Technologies for the IBM 3081 Processor Unit".

Affiliated with

Also associated with

Rating

LSI package board does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with LSI package board, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and LSI package board will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1248502