Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Patent
1993-03-24
1998-10-20
Thomas, Tom
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With provision for cooling the housing or its contents
257718, 257719, H01L 2334
Patent
active
058250883
ABSTRACT:
A ceramic package and mounting structure which requires less surface area on a heat sink and improves heat transfer to the heat sink. Each ceramic package has a top side and a bottom side with the bottom side being flat and smooth. The bottom side can be a polished ceramic, or a metal layer which is plated or brazed to the bottom side. The mounting structure includes a clamp in pressure engagement with the top side of the package and maintains the package pressure engagement with the heat sink.
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patent: 4141028 (1979-02-01), Hvlstrunk
patent: 4259685 (1981-03-01), Romano
patent: 4649460 (1987-03-01), Marchisi et al.
patent: 4672422 (1987-06-01), Schierz
patent: 4768352 (1988-09-01), Maruyama
patent: 4965658 (1990-10-01), Norbeck et al.
Ostrowski David
Spectrian, Inc.
Thomas Tom
Woodward Henry K.
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