Low temperature, single side, multiple step etching process for

Details Low temperature, single side, multiple step etching process for Low temperature, single side, multiple step etching process for

1990-06-07

1992-07-21

Golian, Joseph

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

156644, 156662, 346140R, C23F 100

Patent

active

051319780

ABSTRACT:
A fabrication process for wafer derived elements such as channel plates for thermal ink jet printers includes formation of a final etchant pattern in first and second masking layers. The second masking layer is a protective layer to prevent removal of the first layer upon removal of a subsequent third masking layer. Preferably, the second masking layer is an oxide applied under low temperature condition to lessen the possibility of inducing formation of oxygen precipitates in the wafer. A third masking layer is formed over the final etchant pattern formed by the first and second masking layers. The third masking layer is patterned to form a precursor structure of a large structure contained in the final etchant pattern. After formation of the precursor structure, the third masking layer is removed and the wafer is subjected to a final etching exposure to form the final etched structures. The process is useful for forming channel plates for thermal ink jet printheads.

REFERENCES:
patent: Re32572 (1988-01-01), Hawkins et al.
patent: 4601777 (1986-07-01), Hawkins et al.
patent: 4789425 (1988-12-01), Drake et al.
patent: 4961821 (1990-10-01), Drake et al.

Affiliated with

Also associated with

Rating

Low temperature, single side, multiple step etching process for does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Low temperature, single side, multiple step etching process for , we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Low temperature, single side, multiple step etching process for will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-841174