Low temperature sealing composition with synthetic zircon

Details Low temperature sealing composition with synthetic zircon Low temperature sealing composition with synthetic zircon

1987-02-13

1988-09-27

Lander, Ferris H.

Compositions: ceramic

Ceramic compositions

Glass compositions, compositions containing glass other than...

501 17, 501 18, 501 32, C03C 824, C03C 1400, C03C 814, C03C 820

Patent

active

047742089

ABSTRACT:
A sealing composition suitable for sealing alumina packages for integrated circuits at a temperature below about 450.degree. C. for a short time of about 10 minutes. The composition is a mixture of 50-80 wt % vitreous PbO-B.sub.2 O.sub.3 solder glass powder having a deformation point of 350.degree. C. or less, 0-45 wt % low thermal expansion ceramic powder and 2-40 wt % zircon powder. The zircon powder is of a synthetic zircon artificially prepared to eliminate radioactive impurities such as uranium and/or thorium and contains 0.5-7 wt % Fe.sub.2 O.sub.3, MnO and/or ZnO without alkali impurities and without non-reacted zirconium oxide. The composition has an improved flowability.

REFERENCES:
patent: 4621064 (1986-11-01), Matsuura et al.

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