Low temperature insitu image reversal process for microelectric

Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step

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Details

156657, 156662, 156667, 156904, 1566591, H01L 21306, B44C 122, C03C 1500, C03C 2506

Patent

active

053404386

ABSTRACT:
An insitu image reversal process which uses a sacrificial coating of indium tin oxide and simultaneously deposits amorphous carbon in openings patterned in the ITO while removing the deposited ITO to expose the underlying coating, thereby completing image reversal.

REFERENCES:
patent: 4613402 (1993-09-01), Losee et al.
patent: 5032221 (1991-07-01), Roselle et al.
patent: 5102498 (1992-04-01), Itoh et al.
patent: 5171401 (1992-12-01), Roselle
patent: 5240554 (1993-08-01), Hori et al.

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