Semiconductor device manufacturing: process – Bonding of plural semiconductor substrates
Reexamination Certificate
2009-05-07
2010-11-16
Malsawma, Lex (Department: 2892)
Semiconductor device manufacturing: process
Bonding of plural semiconductor substrates
C257SE21657
Reexamination Certificate
active
07833879
ABSTRACT:
A spatial light modulator is fabricated by bonding a capping layer over a wafer bearing active reflecting surfaces utilizing a low temperature bonding agent capable of providing a hermetic seal, such as a glass frit. The low temperature bonding agent may be B-stage cured after application to the capping layer, prior to any exposure to the substrate bearing the reflecting surfaces. In accordance with one embodiment of the present invention, the capping layer may comprise a glass wafer pre-bonded with an interposer spacer layer to provide sufficient stand-off between the capping layer and the underlying reflecting structures. In accordance with an alternative embodiment of the present invention, the capping layer may comprise a glass wafer alone, and the bonding agent may include additional materials such as beads or balls to provide the necessary stand-off between the capping layer and the underlying reflective structures.
REFERENCES:
patent: 5667554 (1997-09-01), Kuo
patent: 7265027 (2007-09-01), Yang
patent: 2005/0094242 (2005-05-01), Ishii
patent: 2006/0281227 (2006-12-01), Yang
Malsawma Lex
Miradia Inc.
Townsend and Townsend / and Crew LLP
Ullah Elias
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