Low temperature flexible die attach adhesive and articles using

Details Low temperature flexible die attach adhesive and articles using Low temperature flexible die attach adhesive and articles using

1993-05-27

1995-03-21

James, Andrew J.

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Die bond

257679, H01L 2328, H01L 3902

Patent

active

053999070

ABSTRACT:
Described is a flexible adhesive formulation for bonding a semiconductor device to a flexible substrate and a flexible card containing a semiconductor device which can be processed in a computer.

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