Low temperature ceramic microelectromechanical structures

Details Low temperature ceramic microelectromechanical structures Low temperature ceramic microelectromechanical structures

2008-12-22

2011-12-06

Stark, Jarrett (Department: 2823)

Semiconductor device manufacturing: process

Making device or circuit responsive to nonelectrical signal

Physical stress responsive

C257S415000

Reexamination Certificate

active

08071411

ABSTRACT:
A method of providing microelectromechanical structures (MEMS) that are compatible with silicon CMOS electronics is provided. The method provides for processing and manufacturing is steps limiting a maximum exposure of an integrated circuit upon which the MEMS is manufactured during MEMS manufacturing to below a temperature wherein CMOS circuitry is adversely affected, for example below 400° C., and sometimes to below 300° C. or 250° C., thereby allowing direct manufacturing of the MEMS devices onto electronic integrated circuits, such as Si CMOS circuits.

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