Low-temperature burnt conductive paste and method of manufacturi

Details Low-temperature burnt conductive paste and method of manufacturi Low-temperature burnt conductive paste and method of manufacturi

1987-04-27

1990-01-16

Barr, Josephine

Compositions

Electrically conductive or emissive compositions

Free metal containing

252518, 252514, H01B 106

Patent

active

048941840

ABSTRACT:
A low-temperature burnt conductive paste prepared by dispersing, in an organic vehicle, a base material comprising 50 to 95% by weight of a powder of at least one conductive material selected from the group consisting of a copper alloy, a copper oxide and a copper alloy oxide and 5 to 50% by weight of a glass powder having a softening point of 300.degree. to 600.degree. C. and a coefficient of thermal expansion of 6 to 13.times.10.sup.-6 .degree.C..sup.-1, and a method of manufacturing a printed circuit board using this paste.

REFERENCES:
patent: 4072771 (1978-02-01), Grier
patent: 4305847 (1981-12-01), Stoetzer et al.
patent: 4376725 (1983-03-01), Prabhu
patent: 4400214 (1983-08-01), Ogawa et al.
patent: 4446059 (1984-05-01), Eustice
patent: 4517155 (1985-05-01), Prakash et al.
patent: 4623482 (1986-11-01), Kuo et al.
patent: 4687597 (1987-08-01), Siuta

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