Low stress semiconductor die attach

Details Low stress semiconductor die attach Low stress semiconductor die attach

2006-05-09

2006-05-09

Lee, Eddie C. (Department: 2811)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Die bond

C257S778000, C257S779000, C257S663000, C257S676000, C257S674000, C257S783000, C257S773000

Reexamination Certificate

active

07042103

ABSTRACT:
A semiconductor device (121) is provided which comprises a substrate and a die (123) having a first surface which is attached to the substrate by way of a die attach material. At least a portion (127) of the perimeter of the die is resistant to wetting by the die attach material, either through treatment with a dewetting agent or by selective removal of the backside metallization. It is found that this construction allows the surface area of the die to be increased without increasing the incidence of cracking and chipping along the sawn edges of the die.

REFERENCES:
patent: 4918511 (1990-04-01), Brown
patent: 4952999 (1990-08-01), Robinson et al.
patent: 5075254 (1991-12-01), Robinson et al.
patent: 5350662 (1994-09-01), Chi
patent: 5378926 (1995-01-01), Chi et al.
patent: 5409863 (1995-04-01), Newman
patent: 5435732 (1995-07-01), Angulas et al.
patent: 5483092 (1996-01-01), Kosaki
patent: 5773878 (1998-06-01), Lim et al.
patent: 5804880 (1998-09-01), Mathew
patent: 5825093 (1998-10-01), Guo et al.
patent: 6169322 (2001-01-01), Chang et al.
patent: 6184560 (2001-02-01), Kawai
patent: 6672947 (2004-01-01), Tsao et al.
patent: 6687987 (2004-02-01), Mayer et al.
patent: 2002/0182385 (2002-12-01), Senkevich et al.
patent: 0023534 (1981-11-01), None

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