Electricity: conductors and insulators – Feedthrough or bushing – Compression
Patent
1983-05-12
1985-11-19
Larkins, William D.
Electricity: conductors and insulators
Feedthrough or bushing
Compression
357 65, 357 81, 174 685, H01L 2314, H01L 2310, H01L 2334
Patent
active
045545758
ABSTRACT:
A leadless integrated circuit chip carrier apparatus and method of assembly to a printed circuit board. A plurality of castellations are provided in the perimeter walls of the carrier member and solder preforms are deformably fitted in the castellations for reflow vapor phase soldering to the printed circuit board. A spacer member is disposed between the carrier member and the printed circuit board and has a thermal coefficient of expansion matched to that of the solder. The spacer includes a high thermal conductivity planar metal portion sandwiched between an adhesive epoxy layer which facilitates assembly of the carrier to the circuit board.
REFERENCES:
patent: 4332341 (1982-01-01), Minetti
patent: 4366342 (1982-12-01), Breedlove
patent: 4383363 (1973-05-01), Hayakawa et al.
"Adhesive-Metal Shim Module Capping Technique", Dunn et al., IBM Technical Disclosure Bulletin, vol. 25, No. 4, Sep. 1982, p. 1841/2.
"Use of Metal Core Substrates for Leadless Chip Carrier Interconnection"--Lassen--Electronic Packaging and Production, vol. 21, No. 3, (Mar. 1980), p. 98/104.
"Chip-Package Substrate Cushions Dense, High Speed Circuitries"--Electronics, Jul. 14, 1982.
Clark Sheila V.
Larkins William D.
Sutcliff W. G.
Westinghouse Electric Corp.
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