Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – With provision to conduct electricity from panel circuit to...
Patent
1998-06-17
2000-09-05
Donovan, Lincoln
Electrical connectors
Preformed panel circuit arrangement, e.g., pcb, icm, dip,...
With provision to conduct electricity from panel circuit to...
439330, H01R 1200, H01R 100
Patent
active
06113399&
ABSTRACT:
A socketed integrated circuit packaging system, including a packaged integrated circuit and a socket therefor, is disclosed. The integrated circuit package includes a device circuit board to which a thermally conductive slug is mounted; the underside of the device circuit board has a plurality of lands arranged in an array. The integrated circuit chip is mounted to the slug, through a hole in the device circuit board, and is wire-bonded to the device circuit board and thus to the lands on the underside. The socket is a molded frame, having a hole therethrough to receive the conductive slug of the integrated circuit package; the socket may also have its own thermally conductive slug disposed within the hole of the frame. The socket has spring contact members at locations matching the location of the lands on the device circuit board. The integrated circuit package may be inserted into the socket frame, held there by a metal or molded clip. A low profile, low cost, and high thermal conductivity package and socket combination, is thus produced.
REFERENCES:
patent: 3795884 (1974-03-01), Kotaka
patent: 3951495 (1976-04-01), Donaher et al.
patent: 4190879 (1980-02-01), Tissot
patent: 4553192 (1985-11-01), Babuka
patent: 4620761 (1986-11-01), Smith et al.
patent: 4630172 (1986-12-01), Stenerson et al.
patent: 4688151 (1987-08-01), Kraus et al.
patent: 5012386 (1991-04-01), McShane et al.
patent: 5088930 (1992-02-01), Murphy
patent: 5120678 (1992-06-01), Moore et al.
patent: 5157480 (1992-10-01), McShane et al.
patent: 5202288 (1993-04-01), Doering et al.
patent: 5216278 (1993-06-01), Lin et al.
patent: 5280409 (1994-01-01), Selna et al.
patent: 5282111 (1994-01-01), Hopfer
patent: 5285352 (1994-02-01), Pastore et al.
patent: 5291062 (1994-03-01), Higgins, III
patent: 5298686 (1994-03-01), Bourdelaise et al.
patent: 5309324 (1994-05-01), Herandez et al.
patent: 5324205 (1994-06-01), Ahmad
patent: 5403776 (1995-04-01), Tsuji et al.
patent: 5455456 (1995-10-01), Newman
patent: 5557504 (1996-09-01), Siegel et al.
patent: 5570273 (1996-10-01), Siegel et al.
Chiu Anthony M.
Hundt Michael J.
Carlson David V.
Donovan Lincoln
Galanthay Theodore E.
Jorgenson Lisa K.
Nasri Javaid
LandOfFree
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