Low profile modular phone jack assembly

Details Low profile modular phone jack assembly Low profile modular phone jack assembly

1986-09-15

1987-10-06

Abrams, Neil

Electrical connectors

Preformed panel circuit arrangement, e.g., pcb, icm, dip,...

Distinct contact secured to panel circuit

439676, H01R 909

Patent

active

046980253

ABSTRACT:
A low profile right angle phone jack for use with printed circuit boards is disclosed. The jack includes a dielectric housing member having a modular plug receiving socket formed therein, a forward mating end and a rearward end. The socket is defined by a plug-receiving opening forned in the forward mating end with a lower latch receving region and extends rearwardly to meet a back surface provided in the housing member. The housing member is mounted with its forward mating end disposed beyond an edge of the printed circuit board. The forward mating end of the housing member is offset downwardly so that the lower latch receiving region of the plug receiving opening is below the upper surface of the circuit board. In addition, the housing member cooperates with the printed circuit board surface to define the socket whereby the upper surface of the circuit board is the bottom surface of the socket. The low profile modular jack is for use with printed circuit boards arranged in modern closely-spaced mother-daughter arrangements.

REFERENCES:
patent: 4618207 (1986-10-01), Silbernagel
patent: 4647136 (1987-03-01), Kinoshita et al.

Affiliated with

Also associated with

Rating

Low profile modular phone jack assembly does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Low profile modular phone jack assembly, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Low profile modular phone jack assembly will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2115247