Low pressure sensor with a thin boss and method of manufacture

Semiconductor device manufacturing: process – Making device or circuit responsive to nonelectrical signal – Physical stress responsive

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438 50, 438 51, H01L 2100

Patent

active

060935790

ABSTRACT:
A robust and highly sensitive pressure sensing device with good linearity made with a thin-bossed diaphragm, and a process to manufacture the same that involves minimal additional steps and is fully compatible with conventional bulk micromachining processes that are used to make standard pressure sensors.

REFERENCES:
patent: 5002901 (1991-03-01), Kurtz et al.
patent: 5702619 (1997-12-01), Kurtz et al.
patent: 5891751 (1999-04-01), Kurtz et al.
"Compensation Structures for Convex Corner Micromachining in Silicon," Puers, et al., Sensors and Actuators, A-21-A23, (1990) pp. 1036-1041.
"Improvement of Piezoresistive Multiple Sensor," Ugai, et al., The 7th Int'l Conference on Solid State Sensors and Actuators, Digest of Technical Papers, pp. 602-605, no date.

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