Semiconductor device manufacturing: process – Making device or circuit responsive to nonelectrical signal – Physical stress responsive
Patent
1998-06-01
2000-07-25
Picardat, Kevin M.
Semiconductor device manufacturing: process
Making device or circuit responsive to nonelectrical signal
Physical stress responsive
438 50, 438 51, H01L 2100
Patent
active
060935790
ABSTRACT:
A robust and highly sensitive pressure sensing device with good linearity made with a thin-bossed diaphragm, and a process to manufacture the same that involves minimal additional steps and is fully compatible with conventional bulk micromachining processes that are used to make standard pressure sensors.
REFERENCES:
patent: 5002901 (1991-03-01), Kurtz et al.
patent: 5702619 (1997-12-01), Kurtz et al.
patent: 5891751 (1999-04-01), Kurtz et al.
"Compensation Structures for Convex Corner Micromachining in Silicon," Puers, et al., Sensors and Actuators, A-21-A23, (1990) pp. 1036-1041.
"Improvement of Piezoresistive Multiple Sensor," Ugai, et al., The 7th Int'l Conference on Solid State Sensors and Actuators, Digest of Technical Papers, pp. 602-605, no date.
Exar Corporation
Picardat Kevin M.
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