Low loop wire bonding

Details Low loop wire bonding Low loop wire bonding

1996-06-04

1998-04-07

Bray, W. Donald

Metal working

Scale remover or preventor

Scraper or scalper

29827, 29843, 174 524, 257686, 437217, H01R 4300

Patent

active

057350302

ABSTRACT:
A method of making a wire connection in a microelectronic device, preferably a semiconductor device, which includes providing a microelectronic device (7) having a bond pad (5) thereon and a wire bonding location (9) external to the microelectronic device, such as the lead finger of a lead frame. A wire (1) is provided for connection to the lead finger and the bond pad (5) to which a ball (21) has first been bonded. The ball (21) is preferably of gold and is of a material electrically compatible with the material of the wire on the bond pad. One end of the wire is connected to the lead finger (9) by a ball bond (23) and then the other end of the wire is connected to the ball (21) to complete the connection and provide a connection without a loop over the bond pad.

REFERENCES:
patent: 5025114 (1991-06-01), Braden
patent: 5056217 (1991-10-01), Yamazaki et al.
patent: 5229329 (1993-07-01), Chai et al.
patent: 5249354 (1993-10-01), Richman
patent: 5291061 (1994-03-01), Ball
patent: 5441429 (1995-08-01), Seibler

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