Low leakage one transistor static random access memory

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode

Reexamination Certificate

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Reexamination Certificate

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07064371

ABSTRACT:
The invention forms a 1T Static Random Access Memory (SRAM) with a low concentration cell node region and a higher concentration bit line region (e.g., second bit line region). The method of the invention forms a 1T Static Random Access Memory (SRAM) that uses a resist mask to block a high concentration implant into the cell node region, but allows the high concentration implant into the bit line region to form a second (high concentration) bit line. The invention's 1T SRAM, with the low concentration cell node, has reduced p-n junction leakage at the cell node and increase date retention time.

REFERENCES:
patent: 5134085 (1992-07-01), Gilgen et al.
patent: 5686336 (1997-11-01), Lee
patent: 5953606 (1999-09-01), Huang et al.
patent: 5998820 (1999-12-01), Chi
patent: 6078087 (2000-06-01), Huang et al.
patent: 6262447 (2001-07-01), Chi
patent: 6274441 (2001-08-01), Mandelman et al.
patent: 6504780 (2003-01-01), Leung
Leung et al., “The Ideal SoC Memory: 1T-SRAM”, 13th International ASIC/SoC Conference Proceedings, IEEE, Sep. 13-16, 2000, pp. 32-35.

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