Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum
Reexamination Certificate
2006-04-07
2009-10-06
Zarneke, David A (Department: 2891)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Of specified material other than unalloyed aluminum
C257S767000, C257SE23145
Reexamination Certificate
active
07598614
ABSTRACT:
An interconnect structure which includes a metal-containing cap located atop each conductive feature that is present within a dielectric material is provided in which a surface region of the metal-containing cap is oxidized prior to the subsequent deposition of any other dielectric material thereon. Moreover, metal particles that are located on the surface of the dielectric material between the conductive features are also oxidized at the same time as the surface region of the metal-containing cap. This provides a structure having a reduced leakage current. In accordance with the present invention, the oxidation step is performed after electroless plating of the metal-containing cap and prior to the deposition of a dielectric capping layer or an overlying interlayer or intralevel dielectric material.
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Gambino Jeffrey P.
Gill Jason P.
Smith Sean
Wynne Jean E.
International Business Machines - Corporation
Kotulak, Esq. Richard M.
Scully , Scott, Murphy & Presser, P.C.
Wagner Jenny L
Zarneke David A
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