Low-K interlevel dielectric materials and method of forming...

Details Low-K interlevel dielectric materials and method of forming... Low-K interlevel dielectric materials and method of forming...

2008-03-24

2010-10-26

Cleveland, Michael (Department: 1712)

Coating processes

Heat decomposition of applied coating or base material

Reexamination Certificate

active

07820242

ABSTRACT:
A composition of matter and a structure fabricated using the composition. The composition comprising: a resin; polymeric nano-particles dispersed in the resin, each of the polymeric nano-particle comprising a multi-arm core polymer and pendent polymers attached to the multi-arm core polymer, the multi-arm core polymer immiscible with the resin and the pendent polymers miscible with the resin; and a solvent, the solvent volatile at a first temperature, the resin cross-linkable at a second temperature, the polymeric nano-particle decomposable at a third temperature, the third temperature higher than the second temperature, the second temperature higher than the first temperature, wherein a thickness of a layer of the composition shrinks by less than about 3.5% between heating the layer from the second temperature to the third temperature.

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