Low heat loss and secure chip carrier for cryogenic cooling

Details Low heat loss and secure chip carrier for cryogenic cooling Low heat loss and secure chip carrier for cryogenic cooling

1994-09-20

1996-08-06

Crane, Sara W.

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With provision for cooling the housing or its contents

257712, 257713, 257718, 257719, 361704, 361707, H01L 2334, H05K 720

Patent

active

055436625

ABSTRACT:
An integrated circuit package is disclosed. The integrated circuit package includes a substrate having a cavity formed therein for enclosing an integrated circuit. The integrated circuit package also includes a carrier for holding the integrated circuit. The carrier is positioned within the cavity of the substrate. A thermally reactive connector is coupled to the carrier. The thermally reactive connector is for selectively coupling the carrier to the substrate when a temperature of the thermally reactive connector is above a first temperature such that the carrier is held in position within the opening. The thermally reactive connector is also for decoupling the carrier from the substrate when the carrier temperature is at the first temperature. In this manner, the number of thermal paths between the integrated circuit and the substrate of the integrated circuit is reduced.

REFERENCES:
patent: 5294750 (1994-03-01), Sakai et al.

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