Low energy ion etching

Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step

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Details

156643, 156654, 2504923, B44C 122, C03C 1500

Patent

active

045307342

ABSTRACT:
A substrate is irradiated in a pattern with a neutron beam at energy levels well below those which produce either atomic reactions or physical disruption of the substrate structure. When etched with a suitable etchant, the irradiated portions are preferentially etched to produce a pattern corresponding to the irradiated pattern. In one embodiment of the invention, aluminosilicate crystals are irradiated with neutrons and are etched with hydrofluoric acid to produce the etched structure.

REFERENCES:
patent: 3303085 (1967-02-01), Price et al.
patent: 3612871 (1971-10-01), Crawford et al.

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