Low dielectric constant, low moisture uptake polyimides and copo

Details Low dielectric constant, low moisture uptake polyimides and copo Low dielectric constant, low moisture uptake polyimides and copo

1992-09-18

1993-12-07

Beck, Shrive

Coating processes

Electrical product produced

Integrated circuit, printed circuit, or circuit board

4273881, B05D 512

Patent

active

052681939

ABSTRACT:
A group of polyimides and copolyimides made from 2,2-bis(3,4-dicarboxyphenyl)hexafluoropropane dianhydride (6FDA) or 2,2-bis(3,4-dicarboxyphenyl)propane dianhydride (IPAN) their acid or ester forms and selected aromatic diamines are disclosed which are useful for substrate coatings and interlevel dielectrics in on-chip and multi-chip package applications. In such applications these polymers exhibit lower dielectric constant, lower moisture uptake and reduced dielectric constant variation with temperature and humidity than existing polymers, yet they are both thermally stable at required processing temperatures and can form suitably adherent, pinhole-free coatings on electronic component substrates.

REFERENCES:
patent: 3179614 (1965-04-01), Edwards
patent: 3179634 (1965-04-01), Edwards
patent: 4336175 (1982-06-01), Gibbs
patent: 4528004 (1985-07-01), Makino et al.
patent: 4681928 (1987-07-01), Berger et al.
patent: 4720539 (1988-01-01), Rabilloud et al.
patent: 4760126 (1988-07-01), Numata et al.
patent: 4876329 (1989-10-01), Chiang et al.
patent: 4877653 (1989-10-01), Vora et al.
patent: 4927736 (1990-05-01), Mueller et al.
patent: 5114826 (1992-05-01), Kwong et al.

Affiliated with

Also associated with

Rating

Low dielectric constant, low moisture uptake polyimides and copo does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Low dielectric constant, low moisture uptake polyimides and copo, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Low dielectric constant, low moisture uptake polyimides and copo will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2014492