Low defectivity product slurry for CMP and associated...

Details Low defectivity product slurry for CMP and associated... Low defectivity product slurry for CMP and associated...

2005-12-27

2005-12-27

Nguyen, George (Department: 3723)

Abrading

Abrading process

Abradant supplying

C451S446000, C210S749000

Reexamination Certificate

active

06979252

ABSTRACT:
A low defectivity colloidal silica-based product slurry for use in chemical mechanical planarization (CMP) and an associated production method are described. The product slurry is produced using centrifugation of and optionally with addition of a surfactant to a starting colloidal silica (which can be a commercially available colloidal silica). The product slurry has substantially lower levels of soluble polymeric silicates than does the starting colloidal silica and affords lower defectivity levels when used in a slurry for CMP processing than does the starting colloidal silica.

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