Metal treatment – Barrier layer stock material – p-n type – With recess – void – dislocation – grain boundaries or channel...
Patent
1983-06-24
1985-06-11
Saba, William G.
Metal treatment
Barrier layer stock material, p-n type
With recess, void, dislocation, grain boundaries or channel...
29576E, 29576W, 29576J, 29578, 148175, 148DIG26, 148174, 156612, 156DIG65, 156DIG88, 357 4, 357 50, H01L 2120, H01L 2176
Patent
active
045226610
ABSTRACT:
The purity and perfection of a semiconductor is improved by depositing a patterned mask (12) of a material impervious to impurities of the semiconductor on a surface (14) of a blank (10). When a layer (40) of semiconductor is grown on the mask, the semiconductor will first grow from the surface portions exposed by the openings (16) in the mask (12) and will bridge the connecting portions of the mask to form a continuous layer (40) having improved purity, since only the portions (42) overlying the openings (16) are exposed to defects and impurities. The process can be reiterated and the mask translated to further improve the quality of grown layers.
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Daud Taher
Morrison Andrew D.
Jones Thomas H.
Manning John R.
McCaul Paul F.
Saba William G.
The United States of America as represented by the Administrator
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