Low-cost power device package with quick connect terminals and e

Details Low-cost power device package with quick connect terminals and e Low-cost power device package with quick connect terminals and e

1983-11-03

1985-07-16

James, Andrew J.

357 72, 357 80, H01L 2334, H01L 2348, H01L 2328

Patent

active

045300038

ABSTRACT:
A semiconductor device package structure having a conventional base outline, a heat spreader, and top-mounted, quick-connect terminals for external connection is described. A pre-packaged semiconductor device is attached to a lead frame containing terminals in a predetermined configuration, and then overmolded with a plastic encapsulant so that the heat spreader of the prepackaged device protrudes a predetermined distance from the mounting surface of the package to make possible good thermal contact with a heat sink. Insulated means to facilitate mounting are built-in.

REFERENCES:
patent: 3290564 (1966-12-01), Wolff, Jr.
patent: 3729573 (1973-04-01), Dunn
patent: 3783347 (1974-01-01), Vladik
patent: 4117508 (1978-09-01), Koenig
patent: 4158745 (1979-06-01), Keller
patent: 4199654 (1980-04-01), DeRoss
patent: 4249034 (1981-02-01), Fichot et al.
patent: 4252864 (1981-02-01), Coldren
patent: 4259685 (1981-03-01), Romano
"Triacs Shed Heat Well"-Electronics-Oct. 12, 1978, vol. 51, No. 21, pp. 158-160.

Affiliated with

Also associated with

Rating

Low-cost power device package with quick connect terminals and e does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Low-cost power device package with quick connect terminals and e, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Low-cost power device package with quick connect terminals and e will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1738716